Abstract
The rapid evolution of AI technology is driving the emergence of new applications across various fields, including design solutions utilizing EDA tools. The integration of AI in EDA tools represents a significant leap forward in design methodology.
This presentation provides valuable insights into the current and forthcoming AI/ML innovations in EDA tools that focus on enhancing Power, Performance, and Area (PPA), boosting productivity, and improving Quality of Results (QoR) in digital, custom, and 3DIC designs tailored for TSMC’s technologies.
Furthermore, the initial promising outcomes demonstrate how TSMC, in collaboration with EDA partners, is at the forefront of pushing the boundaries of IC design through the ongoing development of AI technologies."
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